| 摘要 |
A lead-frame for a semiconductor device has an input lead partially projecting from both sides of the semiconductor device and an output lead projecting from both sides of the semiconductor device and connected through bonding wires to bonding pads on a semiconductor chip, and one end portion of the input lead and one end portion of the output lead both unused for an electrical connection to a circuit board are separated from the remaining portions so as to decrease a parasitic capacitance.
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