| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamic acid solution and a polyamic acid film which can easily give bonded polyimide objects having high bonding strength. SOLUTION: This invention provides a polyamic acid solution for bonding a polyimide, which comprises 100 pts.wt. polyamic acid solution wherein the solvent in which the polyamic acid is dissolved is a mixed solvent containing members selected among water-soluble ether compounds, water-soluble alcohol compounds, water-soluble ketone compounds and water, a compound having an ether group and an alcoholic hydroxyl group in the molecule or a compound having a ketone group and an alcoholic hydroxyl group in the molecule and 1-70 pts.wt. polyethylene glycol and a polyamic acid film for bonding a polyimide, which is prepared by casting the polyamic acid solution on a support, drying the wet film at 80 deg.C until a self-supporting film is obtained and has a content of the solvent excluding the polyethylene glycol of below 60wt.%. |
