发明名称 DEVICE AND METHOD FOR CUTTING MULTILAYER HEAT INSULATION MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To perform the cutting with small cutting margin between the upper surface side and the lower surface side and with excellent accuracy by guiding the laser beam from a laser beam oscillator to a multi-layer heat insulation material loaded on a loading part, relatively scanning the laser beam to the multi-layer, and pressing the multi-layer heat insulation material in the width direction. SOLUTION: A multi-layer heat insulation material 5 is positioned and loaded on a transmission plate 4 on an XY table 1, the pressing gas is ejected from a pair of nozzle bodies 21 to operate a control device 2, the XY table 1 is driven in the XY direction based on the preset program, and the laser beam L is oscillated from a laser beam oscillator 11. The laser beam L is reflected by a reflection mirror 12, and converged by a machining lens 13, and irradiates an upper surface of the multi- layer heat insulation material 5. Because the multi-layer heat insulation material 5 is driven in the prescribed direction by the XY table 1, the laser beam L scans the upper surface of the multi-layer heat insulation 5, and cuts the multi-layer heat insulation material 5 to the prescribed shape. The vicinity of part irradiated with the laser beam L is pressed by the pressing gas.</p>
申请公布号 JPH10244387(A) 申请公布日期 1998.09.14
申请号 JP19970049147 申请日期 1997.03.04
申请人 TOSHIBA CORP 发明人 KAWADA YOSHITAKA
分类号 B23K26/00;B23K26/06;B23K26/073;B23K26/14;B23K26/40;(IPC1-7):B23K26/00 主分类号 B23K26/00
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