| 摘要 |
PROBLEM TO BE SOLVED: To provide a small semiconductor device whose transmission efficiency of power and a signal is high and which is superior in reliability and to provide a method for easily manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with a circuit board 1, various loading parts 2, 3 4a-4e mounted on the circuit board, non-contact connectors 5 and 6 connected to the end side parts of the circuit board and a resin molding part 7 covering the periphery of the circuit board and the loading parts. The resin molding part 7 is formed so that space is not generated with the non-contact connectors 5 and 6 and thickness becomes almost equal to the heights of the non-contact connectors 5 and 6. The semiconductor device can be formed by molding resin in a die cavity in a state where the circuit board 1 in which the loading parts are mounted and the non-contact connectors are connected to the end side parts is stored in a die cavity and the outer peripheral faces of the non-contact connectors 5 and 6 are pressed by a die cavity face. |
