| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a package of a semiconductor device and enhance electric separation of a signal terminal electrode. SOLUTION: A lead frame 2 is arranged in the center part of a package 1 of a semiconductor device and a signal terminal electrode 3 or a signal terminal electrode 7 is arranged in the peripheral part. A semiconductor chip 8 is mounted on the lead frame 2, and a ground electrode 16 having a ground potential is arranged between a signal terminal electrode 4 and a signal terminal electrode 5, and a ground electrode 17 having a ground potential is arranged between a signal terminal electrode 5 and a signal terminal electrode 6. |
