发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device that reduces a part relying on a manual operation and that improves work efficiency. SOLUTION: A machining sheet A with an electric wire is delivered one by one from a package rack 26 on the supply side to a transporting device 35a, transported to a machining stage 6, 7 by a clamping unit 42, placed on the machining state 6, and irradiated with an excimer laser beam from the upper and lower direction of the wire, so that the surface coat of the wire is removed. Then, using a structure in which the sheet A with machining completed is transported to the package rack 26 on the storage side by means of a clamping unit 44 so as to be stored one by one in the package rack 26, the pack the relies on a manual operation is reduced as much as possible, thereby improving the work efficiency.</p>
申请公布号 JPH10244388(A) 申请公布日期 1998.09.14
申请号 JP19970046723 申请日期 1997.02.28
申请人 MITSUBISHI HEAVY IND LTD 发明人 TAKAHASHI SHINJI;YAMAUCHI TOMOFUMI;KAWAMURA TAKEYA;SHIMOYAMA KIMIHIRO;AKAHA TAKASHI
分类号 B23K37/00;B23K26/00;B23K26/02;B23K26/08;H02G1/12;(IPC1-7):B23K26/02 主分类号 B23K37/00
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