| 摘要 |
PROBLEM TO BE SOLVED: To contrive the retrenchment of high-cost material and the enhancement of the effectiveness of the processes at the time of the manufacture of a semiconductor package by a method wherein the cut-off part of a defective printed circuit board unit is removed to bore cutting holes in the defective printed circuit board unit and the cut-off parts, which are previously prepared in a shape and a size, which coincide with those of the cutting holes, of normal printed circuit board units are made to insertedly support in the cutting holes. SOLUTION: A short-circuit between conductive traces 13 formed on individual printed circuit board units, a defective appearance out of the appearances of the units or the like is inspected and cutting holes are bored in the unit 11' decided a defective along the regions between singulation lines 17 and slots 17c for bending prevention use or cutting lines 16, which are positioned in the lines 17. The cut-off parts, which have the area and the shape equal to those of such cutting holes, of the normal printed circuit board units are provided in such a way that they are made to insertedly support in the cutting holes. Thereby, the enhancement of the yield at the time of the manufacture of a semiconductor package and the enhancement of the production of the package can be contrived. |
