| 摘要 |
PROBLEM TO BE SOLVED: To increase the connection strength and reliability of the wire connecting to a supporting board, by a method wherein an intrusion stopping means preventing a junction material from intruding into wire connecting regions is provided between a semiconductor fixing region and wire connecting regions. SOLUTION: A partial dent 10 is provided on the upper side of a supporting board 4 so as to fix a semiconductor chip 6 on the bottom face of the dent 10 through the intermediary of a junction material 5. The area of the dent 10 is made wider than that of a semiconductor chip fixing region 11 as shown by two point chain line. Besides, the dent 10 is formed toward the drain lead side so as to make the upper side part of the supporting board side toward the gate lead to be the edge part wider than the drain lead side for constituting a wire connecting part 12. Furthermore, the parts of the wire connecting part 12 are formed into wire connecting regions 13 as shown by two point chain lines. Accordingly, the upper sides of the wire connecting regions 13 are made higher than that of the semiconductor chip fixing region 11, thereby preventing the junction material 5 from creeping up the upper sides of the wire connecting regions 13. |
