MANUFACTURE OF LIGHT EMITTING ELEMENT AND SURFACE LIGHT SOURCE DEVICE EQUIPPED THEREWITH

摘要

PROBLEM TO BE SOLVED: To enable a die for forming the leads of a light emitting element or a die for molding sheathing resin to be provided at a low cost. SOLUTION: A required number of light emitting diode(LED) chips 22 are mounted on the light emitting element mounting die pad 28 of a lead inserted into an integrally molded resin, and the LED chip 22 is connected to the pad 27 of the other lead with a bonding wire 26. A die pad 28 where no light emitting element is mounted is directly connected to the pad 27 of the other lead. By this setup, a lead 24 with sheathing resin can be used in common for a light emitting device composed of LED chips varied in number.