| 摘要 |
PROBLEM TO BE SOLVED: To enable a base copper and a build-up resin to be firmly bonded together and to completely bore a hole in the build-up resin through a photovia development-type manufacturing method. SOLUTION: A build-up resin layer 2 which contains a prescribed coupling agent is applied onto the pattern forming surface of a printed board 1 provided with a prescribed first circuit pattern 1a of copper foil, the build-up resin layer 2 is preliminarily dried up at temperatures at which the coupling agent contained in it is not possessed of an adhesive power, and a hole 3 is bored in the build-up resin layer 2 through a photovia development-type manufacturing method so as to reach to the first circuit pattern 1a. Thereafter, a second circuit pattern 4 is formed on the build-up resin layer 2 so as to have a continuity with the first circuit pattern 1a through the hole 3, and then the build-up resin layer 2 is fully heated so as to make the coupling agent possessed of an adhesive power. |
