| 摘要 |
PROBLEM TO BE SOLVED: To shorten the drying/hardening time and prevent a circuit collapse in IC connection by an anisotropic conductive film by forming a conductive paste with flattened silver powder or a mixture of the flattened silver powder and flattened silver-plated copper powder, a thermoplastic resin having the intrusion of a specific value or below up to the specific temperature measured with a thermomechanometric device, and an organic solvent. SOLUTION: This conductive paste is composed of a flattened silver powder or a mixture of the flattened silver powder and flattened silver-plated copper powder as a component A, a thermoplastic resin having the intrusion quantity of 30μm or below up to 100 deg.C measured with a thermomechanometric device as a component B, and an organic solvent as a component C. The blended quantity of the component A of the mixture is set to 40-80 pts.wt. against the total 100 pts.wt. of the components A, B, C, the blended quantity of the component B is set to 2-20 pts.wt., and the blended quantity of the component C is set to 15-45 pts.wt. |
