| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, wherein a suitably roughened surface can be obtained without dissolving resin filler with roughening agent, and a viahole forming hole fine and high in accuracy can be surely formed. SOLUTION: A metal foil 8 with fine irregularities 8a is bonded to an uncured resin layer 6 by pressure. In this state, the resin layer 6 is hardened. Then, the metal foil 8 is removed by wet etching. Next, the surface layer of an interlayer insulating layer 7 is turned to a rough surface 6a. A hole is bored in an interlayer insulating layer 7 by laser irradiation, whereby a hole 9 for a viahole is provided. The rough surface 6a and the hole 9 are subjected to electroless plating, whereby a conductor pattern 13 and a viahole 11 are formed on the interlayer insulating layer 7. In result, a multilayer wiring board 14 can be manufactured.</p> |
