MOUNTING STRUCTURE OF ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To prevent solder balls or solder dust from flying off to adhere to bonding pads in a reflow soldering process by a method wherein sealing wax which is removed by cleaning and high in adhesion to solder is previously applied onto a pattern. SOLUTION: Wax 15 is applied onto bonding pads 13, whereby solder balls 17 or solder dust which fly off to adhere to the wax 15 applied onto the bonding pads 13 (solder balls 17 or solder dust are trapped by wax when it is melt and fixed) are removed together with the wax 15 when a board 10 is subjected to an ultrasonic cleaning process, so that a wire bonding failure related to the solder balls 17 or the solder dust can be prevented in an after process where wire bonding is carried out.