| 摘要 |
PROBLEM TO BE SOLVED: To inspect the height of a bonding wire with high accuracy even when a luminous spot formed by the reflection of illuminating light on the surface of the wire is positionally deviated by a surface defect, such as the flaw, shaved part, etc., on the surface of the wire. SOLUTION: In a method for inspecting bonding wire, the picture data of the luminescent spot image of a bonding wire on a semiconductor chip 11 on each focal plane F1-F5 is obtained by pickup-up the image of the wire 1 by vertically irradiating the wire 1 from the top side while the focal plane is positioned to a plurality of different positions in the height direction and the height of the wire 1 is found based on the luminescent spot at a prescribed position of the picture data of the luminescent spot image obtained at each focal plane F1-F5 and the position of each focal plane in the height direction. At the time of finding the height of the wire 1, the positional deviation of the luminescent spot image on each focal plane between each focal plane is taken into consideration. |
