发明名称 POLISHING DEVICE AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To perform uniform polishing by a small quantity of abrasive by supplying the abrasive in an atomized state to a work object surface in a fixed injection quantity. SOLUTION: A surface plate 11 is rotated, and an abrasive 16 is supplied in an atomized state onto a polisher 12 from an abrasive supply part 15. A workpiece 13 is pressed against the polisher 12 under prescribed pressure, and is polished. A first negative pressure generating part 25 sucks the abrasive 16 is a tank 18 through a suction nozzle 21 and a first flow regulating value 22. It is mixed with the atmosphere taken in through a section flow regulating value 27, and is formed as a lean atomized abrasive 16, and is outputted to a second negative pressure generating part 30. The second negative pressure generating part 30 similarly mixes it with a constant quantity of high pressure air from a third flow regulating valve 32, and makes it leaner, and injects it into the polisher 12. By this constitution, uniform polishing can be performed.
申请公布号 JPH10244468(A) 申请公布日期 1998.09.14
申请号 JP19970048785 申请日期 1997.03.04
申请人 SONY CORP 发明人 SATO SHUZO;OTORII SUGURU
分类号 B24B57/02;B24B37/00 主分类号 B24B57/02
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