DEVICE FOR FORMING LIQUID SOLDER PORTION IN SOLDERING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a practical device for shaping a liquid solder portion into a predetermined form wherein variations of form and position demanded for soldering are kept as small a range as possible especially even if treating conditions and material characteristics are changed. SOLUTION: This device comprises a shaft 10 which vertically moves with respect to a substrate 6 and a coining unit 20 connected to the shaft 10 and having a coining surface 22 at the lower side thereof opposite to the substrate 6 to form a liquid solder portion as a preliminary treatment before a semiconductor chip is soldered to the substrate 6. In this case, the coining unit 20 is vertically guided with respect to the shaft 10 being urged with a spring, while being capable of inclining in any direction with respect to a moving axis of the shaft 10 being supported by friction engagement. The coining unit 20 is provided with a spacing means 24 which is projected from the coining surface 22 to be mounted on the substrate 6.