| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for packaging an electronic part that can completely seal a small gap between the electronic part and a wiring board with resin without making complicate the facility and can obtain a high-quality electronic part packaging body constantly by reducing the variation in the amount of resin at that time. SOLUTION: An electronic part 1 is placed on a wiring board 3, a resin 7 is filled into a gap 8 between the electronic part 1 and the wiring board 3, and then the resin 7 is cured. In the case the resin 7 is to be filled into the gap 8, a nozzle 5 that is constituted so that the resin 7 is discharged due to its dead weight is used, the resin 7 is allowed to flow into the gap from one edge side of the electronic part 1, and the resin 7 is filled to the other edge side by utilizing the discharge force of the resin 7 from the nozzle 5 and a penetration force into the gap 8 due to capillary phenomenon. The resin 7 can be allowed to flow from one edge side to the other edge side between the electronic part 1 and the wiring board 3 by utilizing the characteristics of the resin itself, thus eliminating the need for using a reinforced injection means such as a cylinder and hence the facility can be simplified.</p> |
