| 摘要 |
PROBLEM TO BE SOLVED: To surely dissipate heat from a resin sealed semiconductor device contg. heat dissipating means. SOLUTION: A die 11 is mounted on a die pad 13 forming a part of a lead frame 12 and they are wired by Au wires 14. A heat sink 15 is located below the pad 13 and has upper and lower e.g. conical protrusions 16, 17 within the projection range of the pad 13 at the upper and lower parts of the heat sink 15, thereby forming heat dissipating means. They are sealed with a seal resin 20. The height L1 of the upper protrusion 16 is equal to the height L2 of the lower one 17. If, hence, the heat sink 15 is inserted upside down by mistake in a lower die at a resin seal step, the heat sink will come in place as designed and the protrusions 17 will contact the pad 13. |
