| 摘要 |
PROBLEM TO BE SOLVED: To provide a sample carrier which prevents dust from being deposited on a wafer, without lowering the throughput of a semiconductor manufacturing apparatus. SOLUTION: A leak valve 14 and vacuum pump 10 are provided. When a wafer 4 is carried from an atmospheric chamber 3 into a carrier chamber 2, the vacuum pump 10 evacuates the chamber 2. When the wafer 4 is carried from a vacuum sample chamber 1, the chamber 2 is leaked. Dust swirling up during the leaking and evacuating operation is adsorbed by an electrode 20 disposed at a predetermined distance from a sample and applied with a positive or negative voltage. |
