VERTICALLY INTERCONNECTED ELECTRONIC ASSEMBLIES AND COMPOSITIONS USEFUL THEREFOR

摘要

In accordance with the present invention, multilayer printed circuit boards are provided, the structure of which comprises a plurality of layers (a)-(c) as follows, so as to achieve the desired multiplicity of layers: (a) a bottom circuit layer; (b) a via interconnect layer; and (c) a top circuit layer. In another aspect, the present invention is directed to a multilayer printed circuit board with an attached component or die, the structure of which comprises: (a) a single or multilayer printed circuit board substrate; (b) a via interconnect layer which has electrically conductive adhesive compositions patterned into suitable dielectric materials, where the suitable dielectric materials provide adhesion between the printed circuit board and a component or die while the electrically conductive adhesive compositions provide the electrical interconnection and adhesion between connecting pads of the printed circuit board substrate and the attached component or die; and (c) an area array component package or bare die which is attached to the printed circuit board layer with the use of said suitable patterned dielectric materials.