| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need of a dice picker for housing an IC chip in a tray to lower the equipment cost by forming bumps on the IC chip by a bonding head on a bonding stage, pressing the bump tops to level it and housing the chip in a tape-like holder. SOLUTION: Many wafers 1 are laminated and housed in a carrier 101, the carrier is carried to feed the wafers 1 one by one to a receptor 5, bumps are formed on pads of IC chips 2 transferred one by one from the wafers 1 in the receptor 5 onto a bonding stage 10 with a bonding head 11 of a bonder 6, the chips 2 having the bumps are transferred to a leveler 7 to press the left ends of the bumps and housed in an IC chip housing 8 having tape-like holders 27 or trays. |
