| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which an active component such as a semiconductor element or the like and a passive component such as a capacitive element, a resistor or the like can be connected firmly to a bonding pad formed on an organic-resin insulating layer without generating a crack, a break or the like, and in which the semiconductor element or the like can be driven normally. SOLUTION: A wiring board is formed in such a way that organic-resin insulating layers 2 and thin-film wiring conductor layers 3 are laminated alternately on a board 1, and that the thin-film wiring conductor layer 3 which are situated up and down are connected electrically via through-hole conductors 8 which are formed in the organic-resin insulating layers 2. Bonding pads 9 which are connected electrically to the thin-film wiring conductor layers 3, and to which an external electronic component A is connected, are formed on the surface of the organic-resin insulating layer 2 in the uppermost layer. In this case, the respective organic-resin insulating layers 2 contain a filler whose surface is surface-treated with a silane coupling agent.</p> |
