发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a positive photosensitive composition adapted to exposure to short wavelength light and enhanced in sensitivity and resolution and resistance to dry etching and solubility in solvents by using a resin having repeating structural units having a specified alicyclc ggand an acid-decomposable group. SOLUTION: This positive photosensitive composition contains a compound to be allowed to release an acid by irradiation with activated rays or radiation and the resin having at least one of the groups increased in solubility in an alkaline developing solution by being decomposed by action of an acid and at least one of groups having adamantly groups represented by formulae I-III in which each of R1 , R2 , R5 , R8 , and R9 is an H or halogen atom or a cyano group or the like; each of R4 , R7 , and R10 is a halogen atom or a cyano group or substituent; and each of R3 , R7 , and R11 is an H atom or an alkyl or a cyclic or polycyclic cycloalkyl group or the like.
申请公布号 JPH10239847(A) 申请公布日期 1998.09.11
申请号 JP19970046000 申请日期 1997.02.28
申请人 FUJI PHOTO FILM CO LTD 发明人 AOSO TOSHIAKI;SATO KENICHIRO;TAN SHIRO
分类号 G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/039
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