PLANARIZING METHOD, BURYING METHOD AND TREATING APPARATUS IN SEMICONDUCTOR DEVICE MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To planarize the surface of a cover material layer on a main surface of an approximately flat plate work by centrifuging the work to push the fluid cover material to its main surface. SOLUTION: A fluid cover film 21 is spin-coated on the rough surface of a semiconductor wafer W having a device structure on its main surface and SOG 21 is diffused to coat the surface of the wafer W by a centrifugal force directed radially outwards of the water due to the rotation of the wafer round its center and baked with rotating the wafer round its centerθwhereby the fluid SOG 21 is pushed to the main surface owing to the centrifugal force directed to the main surface of the wafer, resulting in a flow of SOG from protrusions 22 of the substrate surface to recesses 32.