RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To lessen cracking without increasing the area occupied by a resin- sealed semiconductor device. SOLUTION: The device has a semiconductor element 101 packaged with a resin seal and comprises at least a J type lead member 103 bonded so that the outer side face of its one arm 103a may contact the surface of the element 101 and a mold resin part 105 formed so that the outer side face of the other arm 103b of the lead member 103 may be exposed.