| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor device which can electrically connect electrodes of the housed device to a predetermined external electric circuit stably for a long time, without peeling off connecting pads from an insulation board against a high thermal stress due to the thermal expansion coefficient difference between the board and the external electric circuit board. SOLUTION: The package comprises an insulation board 1 having a mounting part 1a of a semiconductor device 3, connecting pads 5 having protrusions 5a formed on the bottom of the board 1, a conductor wiring layer extending from the mounting part 1a to the pads 5, an insulation over layer 7 for covering the bottom surface of the board 1 and pads 5, and outer terminals 8 having spherical protrusions 8a bonded to the pads 5 to cover the protrusions 5a. The thermal stress of the pads 5 is dispersed to avoid peeling off the pads, thus stably connecting the electrodes of the device 3 to external electric circuits for a long time. |
