| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board for suppressing a warp deformation of the board by improving sintering properties of an insulating film covering a conductor formed on a board surface, and improving electric insulation of the film. SOLUTION: In the ceramic circuit board 10 obtained by covering a conductor 2 formed on a board surface with an insulating film 5, the film 5 is obtained by adding 35 to 60wt.% of glass component containing at least SiO2 , PbO, CaO and Na2 O, 40 to 60wt.% of Al2 O3 as ceramic filler and 0.001 to 0.02 pts.wt. of ZrO2 to 100 pts.wt. of the glass component and baking it. In this case, alumina and labradorite are existed as crystal phase. |
