| 摘要 |
PROBLEM TO BE SOLVED: To reduce an area occupied by a multichip module. SOLUTION: A semiconductor chip 11 and a semiconductor chip 12 are mounted on a board 14 according to a chip-on board(COB) system. One or a plurality of semiconductor chips are mounted on a board 15 in the same manner as the board 14. The boards 14, 15 are double-sided wiring boards or multilayer-wiring boards, and a plurality of surface electrodes which are used to input/output signals with reference to the respective mounted semiconductor chips are installed in prescribed positions. Then, the respective surface electrodes are wired from electrodes of the mounted semiconductor chips in a prescribed manner, and electrodes of the mounted semiconductor chips and electrodes of other semiconductor chips are wired in a prescribed manner. In addition, bump electrodes 16A are formed on the respective surface electrodes so as to be sandwiched between the board 14 and the board 15, and the board 14 and the board 15 are connected mechanically and electrically to each other. Then, bump electrodes 17A in the prescribed number are formed on the rear surface of the board 15, and a multichip module of two-stage type is constituted. |
