| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a compact and high-air-tightness package for housing electronic components which never causes a flange to peel off or an insulation base to crack at welding even when the outline size of the flange is small. SOLUTION: The package comprises an insulation base 1 having a mount 1a for an electronic component 4 at the top face, a flange 9 which is fixed to the base 1 and has a periphery protrudent to the outside of the base 1, and a metal cap 2 having a flange 2a having approximately the same size as the flange 9 and welded to the periphery 9a of the flange 9. In this case, the periphery 9a is made thicker than other regions. This well relieves the thermal stress in welding, ensures a mechanical strength enough to avoid breaking the air- tightness of the package.</p> |
