| 摘要 |
<p>PROBLEM TO BE SOLVED: To form wiring conductors at a high density using the thin film forming technique, and tightly bond bonding pads to org. resin insulation layers and braze to the bonding pads to enhance the connection reliability of semiconductor elements, capacitive elements, etc. SOLUTION: The board comprises org. resin insulation layers 2 and thin film wiring conductor layers 3 alternately laminated to electrically connect the upper and the lower conductor layers 3 through through-hole conductors 9 provided at the insulation layers 2. An uppermost insulation layer 2a has holes 10 the inner faces of which are electrically connected to the conductor layer 3. Bonding pads 11 are connected to external electronic components A and formed at the inner faces of the holes 10, except their upper top face corners.</p> |
