| 摘要 |
PROBLEM TO BE SOLVED: To seal even a thin semiconductor device with resin by a low-cost mold and then release it from the die by a method wherein a cushioning material is adhered to the semiconductor device and leads and the semiconductor device are electrically connected and then the semiconductor device is so resin- sealed that the cushioning material may be exposed. SOLUTION: A runner to supply resin thorough is formed between an upper mold 1 and a lower mold 2 and gates 4 are formed at the ends of the runner to form a cavity 5 for forming a semiconductor device. In the cavity 5, a lead frame 6 is located and a semiconductor device 7 is electrically connected to the lead frame 6 by means of bumps 8. Then, a cushioning material 9 is fixed to the semiconductor device 7, being brought into contact with the bottom face of the cavity 5. At the bottom face of the cavity 5 under the suctioning material 9, ejector pins 10 to be used when releasing the device from the mold after resin-sealed are installed. When the device is released from the mold, the cushioning material 9 absorbs a shock from the ejector pins 10 and thereby a defective molding which means the cracking of the semiconductor device 7 can be prevented. |
