发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To improve adhesion to a substrate as well as to ensure satisfactory fitness for light in a short wavelength range, high sensitivity and superior resist pattern profile by incorporating a specified resin and a specified compd. SOLUTION: This photoresist compsn. contains a resin having an ester group represented by formula I in each molecule and a compd. generating an acid when irradiated with active light or radiation. In formulae I, II each of R1 -R<4> may be same or different, is H or alkyl and (m) is 1 or 2. The resin is decomposed by the action of the acid to increase the solubility to an alkali soln. and contains repeating structural units corresponding to a monomer represented by formula II (where R5 is H or methyl and A is a single bond, alkylene, substd. alkylene, ether, thio-ether, carbonyl, ester, etc.).
申请公布号 JPH10239846(A) 申请公布日期 1998.09.11
申请号 JP19970043974 申请日期 1997.02.27
申请人 FUJI PHOTO FILM CO LTD 发明人 SATO KENICHIRO;AOSO TOSHIAKI
分类号 G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/039
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