| 摘要 |
PROBLEM TO BE SOLVED: To reduce the whole electric resistance from a positive electrode vessel to a terminal part by forming and depositing a copper-aluminum alloy on adhesive surfaces of aluminum-made negative and positive electrode terminals, in adhering then to a negative electrode lid and the positive electrode vessel, made of an iron-based alloy respectively. SOLUTION: Nickel-plating layers (having a thickness substantially of about 5-10μm) are applied to the respective connecting parts of a negative electrode lid 4 and a positive electrode vessel 1, in connecting aluminum-made negative and positive electrode terminals 10 and 9 respectively to a negative electrode lid 4 and a positive electrode vessel 1 made of an iron-based alloy (e.g. stainless steel), respectively. A copper-plating layer (about 10-20μm practically) is overlappingly applied thereon to closely fit the terminals 10 and 9 respectively and is heated to about 550-650 deg.C in a vacuum or an inert gas to produce a copper-aluminum alloy layer on the adhesive surfaces for adhering them. As a result of this, even when heated to a temperature of about 300-350 deg.C in operating time, creep is not generated.
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