发明名称 SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To make easy the application of a solder resist composition by a roll coater and reduce the migration of lead from it, by making it contain both the acrylate of a novolak type epoxy resin and an imidazole hardening agent, and by adjusting its viscosity to a specific scope at a specific temperature, using a glycolic ether-based solvent. SOLUTION: A solder resist composition contains both the acrylate of the novolak type epoxy resin obtained by the reaction of the glycidyl ether of either phenol novolak or crezol novolak on either acrylic acid or methacrylic acid and such a liquid imidazole hardening agent as 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, and 4-methyl-2-ethylimidazole. Further, its viscosity is adjusted to 0.5-10Pa.s at 25 deg.C, using a kind of glycol ether-based solvent selected for diethylene glycol dimethyl ether and triethylene glycol dimethyl ether.
申请公布号 JPH10242625(A) 申请公布日期 1998.09.11
申请号 JP19970231503 申请日期 1997.08.27
申请人 IBIDEN CO LTD 发明人 ONO YOSHITAKA;GOTO AKIHIKO;NIKI NORIO;ASAI MOTOO
分类号 C08K5/00;C08G59/17;C08L63/10;H05K3/28;H05K3/34 主分类号 C08K5/00
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