| 摘要 |
<p>The invention relates to a cooling apparatus (10) based on heat energy bound to working fluid in phase transition, the cooling apparatus comprising, for conducting elsewhere the heat energy generated by an electronic component (7), elongated cooling elements (1; 6a, 6b; 9a-9f) containing working fluid and extending in at least two different directions forming a matrix of cooling elements, and a heat conducting material (8; 15) binding the matrix of the cooling elements. The cooling elements (6a, 6b; 9a-9f) are arranged parallel to a circuit board level (A) and in at least one direction deviating from the circuit board level (A).</p> |
