CERAMIC MULTILAYER PRINTED CIRCUIT BOARDS WITH EMBEDDED PASSIVE COMPONENTS

摘要

Passive components such as capacitors, resistors, and RF filters can be made by screen printing suitable inks onto green tapes, completed with conductive layers (14, 15) below and above the component ink layers. The resultant green tape stack is then fired to form embedded capacitors. By laminating the green tape stack onto metal support board substrate, shrinkage in the x and y dimensions is limited and the components can maintain close tolerances. When many green tape layers are to be stacked, improved shrinkage is obtained when green tapes having a moderate amount of oxide fillers, e.g., less than about 15 % by weight of the green tape composition, are interleaved with green tape having higher amounts, e.g., above 25 % by weight, of oxide fillers.