| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip carrier for manufacturing a high-reliability semiconductor integrated circuit device in a simple constitution, without needing a precise aligning operation. SOLUTION: A substrate 21 has a recess 23 on the bottom face 24 of which a semiconductor chip 25 and first end 27 of a leading electrode 26 are disposed with other leading electrode part piercing the side wall 22 and extending along the outer face 28 of the side wall 22. A second end 29 of the electrode 26 extends to the top face 30 of the side wall 22. The chip 22 is connected through a wire 31 to one end 27 of the electrode 26 which exists on the bottom face 24 of the recess 23. A continuously sealing pattern 32 surrounding the recess 23 is formed on a part of the top face 30 of the wall 22 located at the recess 23. |
