| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can make a hybrid inte grated circuit device or the like small when the hybrid integrated circuit device is formed, in such a way that a wiring conductor is used as a thin-film wiring conductor formed by a thin-film technique so as to increase the density of an interconnection, and that a capacitance element is built in at the inside. SOLUTION: In a wiring board, organic-resin insulating layers 3a, 3b, 3c and thin-film wiring conductor layers 4a, 4b, 4c are arranged and installed alternately so as to be multilayered, and the thin-film wiring conductor layers 4a, 4b, 4c are connected via through-hole conductors 9 which are installed in the respective organic-resin insulating layers 3a, 3b, 3c. A hole part H is formed at least in one layer out of the organic-resin insulating layers 3a, 3b, 3c, a dielectric ceramic 10 is inserted into the hole part H, and the thin-film wiring conductor layers 4a, 4b, 4c are arranged so as to be faced partly via an organic resin layer 11 on the surface and the rear surface of the dielectric ceramic 10.</p> |
