发明名称 WIRE BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To surely obtain a clamping force necessary for wire cutting, to leave a tail length with a good precision, and to form a stable ball by providing a plurality of piezoelectric elements, between the movable elements and metal clampers of a wire clamping mechanism. SOLUTION: A wire clamping mechanism K, a bonding tool 14, an ultrasonic vibrating mechanism 11, and a torch mechanism 17 for heating the tip section of a wire cut to form a ball are provided. In such a wire bonding apparatus as that, the wire clamping mechanism K is providing with a pair of metal clampers 24 for clamping a wire W, and a pair movable elements 22 united to the metal clampers 24 respectively, and being freely openable and closable. Moreover, a plurality of piezoelectric elements 23A, 23B put between the movable elements 22 and the metal clampers 24 and arranged into the shape of a lattice, a driving unit which opens or closes the metal clampers 24 along with the movable elements 24, and a control unit which controls the driving unit electrically, are provided.
申请公布号 JPH10242196(A) 申请公布日期 1998.09.11
申请号 JP19970039043 申请日期 1997.02.24
申请人 TOSHIBA CORP 发明人 SATO TSUYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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