发明名称 HIGH FREQUENCY CIRCUIT AND ITS PRODUCTION, AND MICROWAVE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To shorten the length of a metallic conductor to be connected and to reduce its loss by preparing a connection pad at an end of a 1st dielectric circuit board set close to a 2nd dielectric circuit board, bending and extending a strip conductor provided on the 2nd dielectric circuit board toward the pad, and electrically connecting an end of the strip conductor to the pad via the metallic conductor. SOLUTION: A dielectric substrate 3a provided on a metallic casing 1 has a bonding pad 2, i.e., a connector on one of its both sides. Meanwhile, a dielectric substrate 3b having a ground conductor 7 one of its both sides is placed in an air gap 4 of the casing 1 with the conductor 7 connected to the casing 1. A strip conductor 5 is provided on the side of the substrate 3b opposite to the conductor 7. Then the conductor 5 is bent toward the substrate 3a and extended up to an almost end of the substrate 3b on the same surface. The pad 2 is electrically connected to the conductor 5 via a metallic wire 6. Thus, the length of the wire 6 can be shortened and its loss is reduced.
申请公布号 JPH10242701(A) 申请公布日期 1998.09.11
申请号 JP19970045409 申请日期 1997.02.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIEDA MORISHIGE;SUEMATSU KENJI;IYAMA YOSHITADA
分类号 H01P1/04;H01P3/08;H01P5/02 主分类号 H01P1/04
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