| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus, for the cutting of a dam bar at a lead frame, which can be used to manufacture various semiconductor devices and which can deal with narrow-pitch leads at a semiconductor device. SOLUTION: This apparatus is provided with a support member 22 which supports a lead frame 12 containing a package 20 on which a semiconductor chip 18 is mounted and resin-molded, with a laser device 24 which is used to cut a dam bar 16 at the lead frame 12 supported by the support member 22 and with a mask 26 which is arranged between the support member 22 and the laser device 24. Then, the apparatus is constituted such that the dam bar 16 at the lead frame 12 is cut by a laser via the mask 26. |
