| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently reduce the remaining halogen ion concn. in a bare chip connection plane, without collapsing solder with pure water by treating flip chip mounted parts with specified prepared water soln. after rinsing them, and then drying them. SOLUTION: In a cleaning tower 4 of a cleaning apparatus a vertical tube 7 for housing works to be washed is freely inserted and settled; the tube having barrel liq. pass holes only at the bottom. Flip chip mounted parts to which a flux removing step has been applied are rinsed with pure water, finished with ultra-pure water, treated with a prepared water soln. contg. a carbonate which can be thermally decomposed and volatilized off at a drying temp. and dried. Such treatment with the water soln. before drying suppresses the collapsing of Pb with the used pure water. |
