| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame by which a semiconductor device can be mounted at high density and which can realize high pin counts, to provide a semiconductor device and to provide their manufacturing method. SOLUTION: An inside inner-lead group 23 is supported by support lead parts 22 via an insulator 25. The inside inner-lead group 23 and an outside inner-lead group 24 are separated so as to form a double arrangement. When a semiconductor device is constituted by using a lead frame constituted in this manner, a semiconductor chip is mounted on the insulator 25, the semiconductor chip, the inside inner-lead group 23 and the outside inner-lead group 24 are connected by metal thin wires so as to be sealed with a resin, and protrusion parts on the bottom face of the inside inner-lead group 23 and the outside inner-lead group 24 can be used as external terminals. Since the external terminals can be arranged two-dimensionally on the bottom face, the semiconductor device can be mounted at high density, its high pin counts can be realized, and a so-called burrless structure in which resin uncut scraps do not exist on side faces of the sealing resin is obtained. |
