| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered wiring board suited for the flip chip mounting of semiconductor devices or BGA mounting. SOLUTION: The board comprises insulation layers 1 having contg. at least an org. resin, and wiring circuits 2 made of at least a low resistance metal such as Cu, Al, Ag or Au. Semiconductor elements 3 are mounted on the uppermost insulation layer 1a having a thermal expansion coefficient of 10×10<-6> / deg.C or less at room temp. to 250 deg.C while the lowermost interconnect layer 1d has a thermal expansion coefficient of 10×10<-6> / deg.C-25×10<-6> / deg.C at the range from room temp. to 250 deg.C. The elements 3 are mounted by means of flip-chip process on the uppermost layer 1a, and the lowermost layer 1d has connecting terminals connected to a mother board through solder.</p> |
