| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bus bar wiring board of structure suitable for further miniaturization by raising the yield in die cutting of a bus bar from a metallic plate. SOLUTION: A plurality of bus bars 3, 4, 5,... are arranged on an insulation board 21, and also one bus bar is provided with a first bypass 6, and another bus bar 4 is provided with a second bypath. A downward portal bus bar 6' is made at one hand of the first and second bypaths, and an upper portal bus bar 7' is made at the other bypath, and at one edge of the said insulating substrate, the downward portal bus bar 6' is arranged downward along the side edge, and the upward portal bus bar 7' is arranged upward. It is to be desired that the upward portal bar 7' should be arranged upward in condition that it straddles one hand of the plane extensions 6A and 6B for supporting and coupling the pendent parts 6a and 6b on both sides of the downward portal bus bar 6'.</p> |
