发明名称 LAMINATED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminated wiring board in which stacking of each wiring board can be performed easily, and also which can surely prevent the dislocation of wiring and the warp of the wring board, and besides protect a pressure- contact terminal without fail, too. SOLUTION: In a laminated wiring board 10 which is constituted by laying plural sheets wiring boards 12 and 13, where pressure-contact terminals 6 are arranged, on top of one another, ribs 14 and 15 are projected on each wiring board 12 and 13, and the height of each rib 14 and 15 is made higher than the pressure contact part 6a of the pressure-contact terminal 6 each, and the ribs 14 and 15 are laid on top of each other. One part each of taper parts are provided in front and in the rear on both sides of the periphery of the wiring board 13 in the lowermost layer out of the wiring boards 12 and 13 stacked and united through each rib 14 and 15, and one pair each of taper parts are made free of catch and release to the elastically transformable hook of the cover to house each wiring board 11, 12, and 13 being united.
申请公布号 JPH10243530(A) 申请公布日期 1998.09.11
申请号 JP19970041161 申请日期 1997.02.25
申请人 YAZAKI CORP 发明人 KOGURE NAOTO;SAIMOTO TETSUROU
分类号 H05K13/04;H02G3/16;H05K1/00;H05K1/14;H05K3/40 主分类号 H05K13/04
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