| 摘要 |
PROBLEM TO BE SOLVED: To put a conductor formed on a dielectric film close to a coplanar line and also to provide a compact conductor by connecting a ground conductor forming a coplanar line to a back ground conductor of a dielectric substrate via a connection conductor, covering the coplanar line with the dielectric film and wrapping the coplanar line in a shielding constitution part. SOLUTION: A coplanar line 7 consisting of a main line 1, a ground conductor 2 and a slot 3 is formed on the surface of a dielectric substrate 5, and the conductor 2 is connected to a back ground conductor 6 of the backside of the substrate 5 via a metallic film 11 on the end face of the substrate 5. Then a substrate consisting of the line 7, the substrate 5 and the conductor 6 is mounted on a plate type ground conductor 10. The line 7 is covered with the 1st and 2nd dielectrics 4 and 9, and the dielectric 9 is covered with a conductor film 8 and also connected to the film 11. |
