| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method, for a multilayered printed wiring board, in which the insulating distance between a metal plate and a printed wiring board is kept constant and in which the insulating property and the reliability of the multilayered printed wiring board can be enhanced. SOLUTION: In a manufacturing method, an object to be laminated on which a metal foil to sandwich a prepreg is arranged between one pair of hot plates via metal plates, a first heating and pressurizing operation is performed, a laminated board in an unhardened state is formed, circuit patterns 4 and through holes 6 are formed on and in the laminated board, a second heating and pressurizing operation is performed, a printed wiring board 1 which is hardened is completely formed, and the printed wiring board 1 is pasted on a metal plate 2 by means of an adhesive 3. |
