| 摘要 |
<p>The time and temperature profile of a substrate carrying components to be soldered passing through a reflow oven (10) divided into sections (11 to 20) is controlled by scanning the substrate as it passes between the sections of the oven with an infrared scanner (SP1 to SP5) to determine the temperature at selected points of the substrate, computing therefrom the actual solder temperatures beneath the components, comparing these with a desired theoretical solder paste curve, and adjusting the oven section temperatures and/or the substrate speed in accordance with the comparison. <IMAGE></p> |
