发明名称 |
Apparatus for polishing wafers |
摘要 |
<p>The present invention provides an apparatus for polishing wafers, wherein high work efficiency in handling a polishing plate is achieved with high flatness finish of the polished wafers. The apparatus has a polishing plate 1 composed of two plates 2, 3, which are superimposed in tight adhesion with each other. The thickness of the polishing plate 1 is adjusted to such a value that the polished wafers may be finished with high flatness across the polished surface. An upper plate 2 is mounted to a top ring 4 by means of a a plurality of rigid supporting member 7 consisting of a hook-shaped plate holding portion 7a and a top ring fixing portion 7b such that a predetermined clearance is left between the upper surface of the upper plate 2 and a flexible thin plate 5 arranged on the lower portion of the top ring 4. The upper and lower plates 2, 3 are polished to be flat and smooth across one side surface to be superimposed of each thereof and then the upper plate 2 and lower plate 3 are superimposed with each other in tight adhesion by surface tension of a liquid. <IMAGE></p> |
申请公布号 |
EP0672499(B1) |
申请公布日期 |
1998.09.09 |
申请号 |
EP19950300850 |
申请日期 |
1995.02.10 |
申请人 |
SHIN-ETSU HANDOTAI COMPANY LIMITED |
发明人 |
TOMINAGA, HIROYOSHI;SUZUKI, YOSHINORI |
分类号 |
B24B37/04;B24B37/30;B24B53/017;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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